Inventor
JUNG JIN MAN
KR42 patents
⚠️ This page may combine multiple inventors who share the name “JUNG JIN MAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
40 patentsUS10361035B1Jul 23, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH27 citations94
US10026558B1Jul 17, 2018
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH9 citations83
US6535375B1Mar 18, 2003
Solid state electrolytic capacitor and lead frame therefor
SAMSUNG ELECTRO MECH20 citations83
US10650971B2May 12, 2020
Capacitor component and method of manufacturing the same
SAMSUNG ELECTRO MECH8 citations82
US10978251B2Apr 13, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US10957488B2Mar 23, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations73
US10784047B2Sep 22, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH4 citations73
US10264680B2Apr 16, 2019
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH2 citations73
US9390852B2Jul 12, 2016
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
SAMSUNG ELECTRO MECH3 citations73
US11309131B2Apr 19, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH4 citations72
US10840024B2Nov 17, 2020
Multilayer capacitor
SAMSUNG ELECTRO MECH2 citations72
US10325725B2Jun 18, 2019
Multilayer capacitor and board having the same
SAMSUNG ELECTRO MECH4 citations71
US12020868B2Jun 25, 2024
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US11955290B2Apr 9, 2024
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11735371B2Aug 22, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11682529B2Jun 20, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11657979B2May 23, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11646158B2May 9, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11488779B2Nov 1, 2022
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US11410815B2Aug 9, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11380487B2Jul 5, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11282648B2Mar 22, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US11031186B2Jun 8, 2021
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11017948B2May 25, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US11984269B2May 14, 2024
Ceramic electronic component
SAMSUNG ELECTRO MECH0 citations61
US11058003B2Jul 6, 2021
Capacitor and board having the same
SAMSUNG ELECTRO MECH0 citations61
US10617008B2Apr 7, 2020
Capacitor and board having the same
SAMSUNG ELECTRO MECH1 citations61
US10306765B2May 28, 2019
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations52
US11217393B2Jan 4, 2022
Capacitor component
SAMSUNG ELECTRO MECH0 citations51
US11031184B2Jun 8, 2021
Capacitor component including external electrode having extended pattern and connection pattern extending from extended pattern
SAMSUNG ELECTRO MECH0 citations51
US10373760B2Aug 6, 2019
Capacitor component
SAMSUNG ELECTRO MECH0 citations51
US9099250B2Aug 4, 2015
Multilayer ceramic capacitor to be embedded in board, method of manufacturing the same, and method of manufacturing board having multilayer ceramic capacitor embedded therein
SAMSUNG ELECTRO MECH1 citations51
US9847172B2Dec 19, 2017
Embedded device, and printed circuit board having the same
SAMSUNG ELECTRO MECH0 citations48
US9396878B2Jul 19, 2016
Multilayer ceramic capacitor, manufacturing method therefor, circuit board having multilayer ceramic capacitor embedded therein, and polishing device for multilayer ceramic capacitor
SAMSUNG ELECTRO MECH1 citations44
US9642260B2May 2, 2017
Embedded multilayer ceramic electronic component and printed circuit board having the same
SAMSUNG ELECTRO MECH0 citations42
US9607762B2Mar 28, 2017
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
SAMSUNG ELECTRO MECH0 citations42
US10840016B2Nov 17, 2020
Capacitor component
SAMSUNG ELECTRO MECH0 citations41
US9607768B2Mar 28, 2017
Multilayer ceramic capacitor and circuit board having the same
SAMSUNG ELECTRO MECH0 citations41
US9324500B2Apr 26, 2016
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations41
US9173294B2Oct 27, 2015
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations38