Inventor
KOLBASOW ANDREJ
DE8 patents
Patents
8 patentsUS11367709B2Jun 21, 2022
Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement
PAC TECH—PACKAGING TECH GMBH2 citations68
US12349287B2Jul 1, 2025
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
PAC TECH—PACKAGING TECH GMBH0 citations56
US12028987B2Jul 2, 2024
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
PAC TECH—PACKAGING TECH GMBH1 citations56
US11217558B2Jan 4, 2022
Method and device for establishing a wire connection as well as a component arrangement having a wire connection
PAC TECH—PACKAGING TECH GMBH0 citations49
US12171066B2Dec 17, 2024
Method for removing and repositioning electronic components connected to a circuit board
PAC TECH—PACKAGING TECH GMBH0 citations47
US12023756B2Jul 2, 2024
Method for removing electronic components connected to a circuit board
PAC TECH—PACKAGING TECH GMBH0 citations47
US12358084B2Jul 15, 2025
Bonding head and bonding apparatus
PAC TECH—PACKAGING TECH GMBH0 citations44
US12485500B2Dec 2, 2025
Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device
PAC TECH—PACKAGING TECH GMBH0 citations39