Inventor

DOGIAMIS GEORGIOS C

US85 patents

Patents

50 patents

US9960849B1May 1, 2018

Channelization for dispersion limited waveguide communication channels

INTEL CORP17 citations94

US10462578B2Oct 29, 2019

Piezoelectric contact microphone with mechanical interface

INTEL CORP40 citations87

US10976822B2Apr 13, 2021

Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems

INTEL CORP12 citations86

US10964178B2Mar 30, 2021

Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems

INTEL CORP10 citations86

US10886606B2Jan 5, 2021

Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems

INTEL CORP11 citations86

US11206008B2Dec 21, 2021

Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies

INTEL CORP7 citations84

US11050155B2Jun 29, 2021

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

INTEL CORP7 citations84

US10629551B2Apr 21, 2020

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

INTEL CORP5 citations84

US10573608B2Feb 25, 2020

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

INTEL CORP9 citations84

US10452571B2Oct 22, 2019

Microelectronic package communication using radio interfaces connected through waveguides

INTEL CORP8 citations84

US10439671B2Oct 8, 2019

Microelectronic devices designed with high frequency communication modules having steerable beamforming capability

INTEL CORP10 citations84

US10079668B2Sep 18, 2018

Waveguide communication with increased link data rate

INTEL CORP8 citations84

US11456721B2Sep 27, 2022

RF front end module including hybrid filter and active circuits in a single package

INTEL CORP4 citations73

US11430751B2Aug 30, 2022

Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications

INTEL CORP2 citations73

US11387200B2Jul 12, 2022

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

INTEL CORP4 citations73

US11335651B2May 17, 2022

Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

INTEL CORP2 citations73

US11223524B2Jan 11, 2022

Package integrated security features

INTEL CORP2 citations73

US11056765B2Jul 6, 2021

Microelectronic devices designed with foldable flexible substrates for high frequency communication modules

INTEL CORP5 citations73

US11037892B2Jun 15, 2021

Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

INTEL CORP4 citations73

US10476545B2Nov 12, 2019

Communication between integrated circuit packages using a millimeter-wave wireless radio fabric

INTEL CORP2 citations73

US10461388B2Oct 29, 2019

Millimeter wave fabric network over dielectric waveguides

INTEL CORP3 citations73

US10410983B2Sep 10, 2019

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package

INTEL CORP6 citations73

US10291283B2May 14, 2019

Tunable radio frequency systems using piezoelectric package-integrated switching devices

INTEL CORP6 citations73

US10263312B2Apr 16, 2019

Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards

INTEL CORP3 citations73

US10256521B2Apr 9, 2019

Waveguide connector with slot launcher

INTEL CORP3 citations73

US10211970B2Feb 19, 2019

Millimeter wave CMOS engines for waveguide fabrics

INTEL CORP3 citations73

US9902152B2Feb 27, 2018

Piezoelectric package-integrated synthetic jet devices

INTEL CORP5 citations73

US9647636B1May 9, 2017

Piezoelectric package-integrated delay lines for radio frequency identification tags

INTEL CORP4 citations73

US12542358B2Feb 3, 2026

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

INTEL CORP0 citations63

US12155133B2Nov 26, 2024

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

INTEL CORP0 citations63

US11658418B2May 23, 2023

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

INTEL CORP0 citations63

US11380624B2Jul 5, 2022

Electromagnetic interference shield created on package using high throughput additive manufacturing

INTEL CORP0 citations63

US11367708B2Jun 21, 2022

Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

INTEL CORP0 citations63

US11282800B2Mar 22, 2022

Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials

INTEL CORP0 citations63

US10992021B2Apr 27, 2021

Cross talk and interference reduction for high frequency wireless interconnects

INTEL CORP0 citations63

US10910305B2Feb 2, 2021

Microelectronic devices designed with capacitive and enhanced inductive bumps

INTEL CORP0 citations63

US12598997B2Apr 7, 2026

Inductor with integrated magnetics

INTEL CORP0 citations62

US12573744B2Mar 10, 2026

Wideband antennas in glass through direct via feeding and glass stacking

INTEL CORP0 citations62

US12525496B2Jan 13, 2026

Glass vias and planes with reduced tapering

INTEL CORP0 citations62

US12444619B2Oct 14, 2025

Physical vapor deposition seeding for high aspect ratio vias in glass core technology

INTEL CORP0 citations62

US12424716B2Sep 23, 2025

RF filters and multiplexers manufactured in the core of a package substrate using glass core technology

INTEL CORP0 citations62

US12424719B2Sep 23, 2025

Compact surface transmission line waveguides with vertical ground planes

INTEL CORP0 citations62

US12368091B2Jul 22, 2025

Package substrate with glass core having vertical power planes for improved power delivery

INTEL CORP0 citations62

US12347761B2Jul 1, 2025

Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate

INTEL CORP0 citations62

Showing the top 50 of 85 patents by PatentIndex Score.

DOGIAMIS GEORGIOS C

Patents

Channelization for dispersion limited waveguide communication channels

Piezoelectric contact microphone with mechanical interface

Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems

Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems

Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems

Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

Microelectronic package communication using radio interfaces connected through waveguides

Microelectronic devices designed with high frequency communication modules having steerable beamforming capability

Waveguide communication with increased link data rate

RF front end module including hybrid filter and active circuits in a single package

Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Package integrated security features

Microelectronic devices designed with foldable flexible substrates for high frequency communication modules

Substrate dielectric waveguides in semiconductor packages

Piezoelectric package-integrated film bulk acoustic resonator devices

Microelectronic devices designed with integrated antennas on a substrate

Piezoelectric package-integrated delay lines

Actuatable and adaptable metamaterials integrated in package

Waveguide connector with tapered slot launcher

Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

Communication between integrated circuit packages using a millimeter-wave wireless radio fabric

Millimeter wave fabric network over dielectric waveguides

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package

Tunable radio frequency systems using piezoelectric package-integrated switching devices

Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards

Waveguide connector with slot launcher

Millimeter wave CMOS engines for waveguide fabrics

Piezoelectric package-integrated synthetic jet devices

Piezoelectric package-integrated delay lines for radio frequency identification tags

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Electromagnetic interference shield created on package using high throughput additive manufacturing

Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials

Cross talk and interference reduction for high frequency wireless interconnects

Microelectronic devices designed with capacitive and enhanced inductive bumps

Inductor with integrated magnetics

Wideband antennas in glass through direct via feeding and glass stacking

Glass vias and planes with reduced tapering

Physical vapor deposition seeding for high aspect ratio vias in glass core technology

RF filters and multiplexers manufactured in the core of a package substrate using glass core technology

Compact surface transmission line waveguides with vertical ground planes

Package substrate with glass core having vertical power planes for improved power delivery

Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate