Inventor
TSANG YANG CORNELIA
US3 patents
Patents
3 patentsUS10811305B2Oct 20, 2020
Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
IBM0 citations50
US10396220B2Aug 27, 2019
Device layer thin-film transfer to thermally conductive substrate
IBM0 citations49
US10243091B2Mar 26, 2019
Device layer thin-film transfer to thermally conductive substrate
IBM0 citations49