Inventor
IZAWA HIROYUKI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “IZAWA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AJINOMOTO KK
10 patentsUS7872125B2Jan 18, 2011
Phenylalanine derivatives
AJINOMOTO KK11 citations92
US7193108B2Mar 20, 2007
Phenylpropionic acid derivatives
AJINOMOTO KK28 citations92
US7160874B2Jan 9, 2007
Phenylalanine derivatives
AJINOMOTO KK21 citations92
US7153963B2Dec 26, 2006
Phenylalanine derivatives
AJINOMOTO KK34 citations92
US7105520B2Sep 12, 2006
Phenylalanine derivatives
AJINOMOTO KK31 citations92
US6855706B2Feb 15, 2005
Phenylalanine derivatives
AJINOMOTO KK40 citations92
US6610710B2Aug 26, 2003
Phenylalanine derivatives
AJINOMOTO KK28 citations92
US7759388B2Jul 20, 2010
Phenylalanine derivatives
AJINOMOTO KK5 citations62
US7605165B2Oct 20, 2009
Phenylalanine derivatives
AJINOMOTO KK7 citations62
US5342963AAug 30, 1994
Optically active pyrrolidine derivative
AJINOMOTO KK0 citations47
HITACHI CHEMICAL CO LTD
4 patentsUS11242472B2Feb 8, 2022
Adhesive film
HITACHI CHEMICAL CO LTD0 citations59
US7202283B2Apr 10, 2007
Method for dissolving saturated polyester solution for decomposing saturated polyester and method for decomposition using the same
HITACHI CHEMICAL CO LTD5 citations58
US11319466B2May 3, 2022
Adhesive film
HITACHI CHEMICAL CO LTD0 citations47
US6780894B2Aug 24, 2004
Treatment liquid for cured unsaturated polyester resin and treatment method thereof
HITACHI CHEMICAL CO LTD1 citations45
KATOGI SHIGEKI
4 patentsUS8518303B2Aug 27, 2013
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI2 citations59
US8138268B2Mar 20, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI2 citations58
US8696942B2Apr 15, 2014
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
KATOGI SHIGEKI0 citations49
US8309658B2Nov 13, 2012
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
KATOGI SHIGEKI0 citations48
RESONAC CORP
3 patentsUS12285767B2Apr 29, 2025
Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film
RESONAC CORP0 citations52
US11935669B2Mar 19, 2024
Method for dispersing conductive particles, and electrostatic adsorption device
RESONAC CORP0 citations52
US12227683B2Feb 18, 2025
Connector production method and adhesive film
RESONAC CORP0 citations50