Inventor
STROTHMANN THOMAS J
US8 patents
⚠️ This page may combine multiple inventors who share the name “STROTHMANN THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC PTE LTD
4 patentsUS10446459B2Oct 15, 2019
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)
STATS CHIPPAC PTE LTD2 citations72
US11961764B2Apr 16, 2024
Semiconductor device and method of making a wafer-level chip-scale package
STATS CHIPPAC PTE LTD0 citations61
US11011423B2May 18, 2021
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC PTE LTD0 citations61
US10181423B2Jan 15, 2019
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC PTE LTD0 citations50
STATS CHIPPAC LTD
3 patentsUS9620413B2Apr 11, 2017
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC LTD4 citations82
US9553162B2Jan 24, 2017
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
STATS CHIPPAC LTD4 citations73
US9704769B2Jul 11, 2017
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)
STATS CHIPPAC LTD3 citations72