Inventor
WIRTZ HEINZ-PETER
CH12 patents
⚠️ This page may combine multiple inventors who share the name “WIRTZ HEINZ-PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC PTE LTD
6 patentsUS12094729B2Sep 17, 2024
Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP
STATS CHIPPAC PTE LTD2 citations72
US10515828B2Dec 24, 2019
Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
STATS CHIPPAC PTE LTD1 citations72
US11222793B2Jan 11, 2022
Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP
STATS CHIPPAC PTE LTD0 citations62
US11961764B2Apr 16, 2024
Semiconductor device and method of making a wafer-level chip-scale package
STATS CHIPPAC PTE LTD0 citations61
US11011423B2May 18, 2021
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC PTE LTD0 citations61
US10181423B2Jan 15, 2019
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC PTE LTD0 citations50
STATS CHIPPAC LTD
2 patentsUS9496195B2Nov 15, 2016
Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
STATS CHIPPAC LTD4 citations83
US9620413B2Apr 11, 2017
Semiconductor device and method of using a standardized carrier in semiconductor packaging
STATS CHIPPAC LTD4 citations82