Inventor
MIEDA TETSUYA
JP18 patents
⚠️ This page may combine multiple inventors who share the name “MIEDA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FURUKAWA ELECTRIC CO LTD
17 patentsUS10115904B2Oct 30, 2018
Transparent resin composition for organic electroluminescent element sealing, resin sheet for organic electroluminescent element sealing, and image display device
FURUKAWA ELECTRIC CO LTD2 citations69
US11139449B2Oct 5, 2021
Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatus
FURUKAWA ELECTRIC CO LTD0 citations59
US10988646B2Apr 27, 2021
Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same
FURUKAWA ELECTRIC CO LTD0 citations59
US12068088B2Aug 20, 2024
Power cable, and method for manufacturing power cable
FURUKAWA ELECTRIC CO LTD0 citations53
US11990253B2May 21, 2024
Insulating resin composition and production method therefor, insulating tape and production method therefor, insulating layer formation method, and power cable and production method therefor
FURUKAWA ELECTRIC CO LTD0 citations53
US11823816B2Nov 21, 2023
Insulating tape for coating connection portion of power cable, method for forming insulating coating on exterior surface of connection portion of power cable, and power cable
FURUKAWA ELECTRIC CO LTD0 citations53
US10079360B2Sep 18, 2018
Resin composition for sealing electronic devices, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations50
US10556974B2Feb 11, 2020
Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations49
US10084153B2Sep 25, 2018
Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element
FURUKAWA ELECTRIC CO LTD1 citations49
US9758690B2Sep 12, 2017
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image
FURUKAWA ELECTRIC CO LTD1 citations49
US9257671B2Feb 9, 2016
Resin composition for sealing organic electroluminescent device; method of producing the same; and adhesive film, gas-barrier film, organic electroluminescent device and organic electroluminescent panel using the resin composition
FURUKAWA ELECTRIC CO LTD0 citations49
US9913324B2Mar 6, 2018
Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films
FURUKAWA ELECTRIC CO LTD1 citations48
US9793511B2Oct 17, 2017
Filler material for organic electroluminescent element and method of sealing organic electroluminescent element
FURUKAWA ELECTRIC CO LTD0 citations48
US10829670B2Nov 10, 2020
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations40
US10829669B2Nov 10, 2020
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations39
US10043996B2Aug 7, 2018
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device
FURUKAWA ELECTRIC CO LTD0 citations39
US10196534B2Feb 5, 2019
Resin composition for sealing electronic device, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations38