Inventor
OOGAYA KAORU
JP2 patents
Patents
2 patentsUS5220199AJun 15, 1993
Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
HITACHI LTD85 citations94
US5027188AJun 25, 1991
Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
HITACHI LTD91 citations94