Inventor

CHANG SHU-MING

TW105 patents

⚠️ This page may combine multiple inventors who share the name “CHANG SHU-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG SHU-MING

XINTEC INC

Stacked chip package and method for forming the same

Electronic device package

Electronic device package and method for forming the same

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package including substrate inclined sidewall and redistribution line

Chip scale sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Sensing module and method for forming the same

Chip package and method for forming the same

Semiconductor chip package and method for manufacturing thereof

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package including recess in side edge

Chip package and method for forming the same

Chip package including substrate having through hole and redistribution line

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Electronic device package

Chip package and method for forming the same

Chip package

Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region

Chip package and method for forming the same

Chip package

IND TECH RES INST

Stacked chip structure and fabrication method thereof

Image sensor module with a three-dimensional die-stacking structure

Wafer level chip scale packaging structure and method of fabricating the same

Bonding structure with buffer layer and method of forming the same

Magnetic shielding package structure of a magnetic memory device

Capacitor device and method for manufacturing the same

Three-dimensional die-stacking package structure

Wafer level chip scale packaging structure and method of fabricating the same

Bonding structure with buffer layer and method of forming the same

Bonding structure with buffer layer and method of forming the same

CHANG SHU-MING

Disposable safety syringe

Electronic device package and fabrication method thereof

Image sensor package and fabrication method thereof

Chip package and fabrication method thereof

Safety syringe with retractable rotation

CHEN WEI-MING

Chip package and fabrication method thereof

Electronic device package and fabrication method thereof

LEE HUNG-JEN

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

CHIEN WEN-CHENG

Electronic device package and method for forming the same

HUGHES AIRCRAFT CO

Flow accelerator for leak detector probe

CHANG HSIANG-HUNG

Three-dimensional conducting structure and method of fabricating the same

TSAI CHIA-LUN

Electronic device package and method for fabricating the same

HIMAX TECH LTD

High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight

MICROSOFT TECHNOLOGY LICENSING LLC

Printed circuit board mesh routing to reduce solder ball joint failure during reflow