Inventor

LIU TSANG-YU

TW106 patents

⚠️ This page may combine multiple inventors who share the name “LIU TSANG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU TSANG-YU

XINTEC INC

Electronic device package and fabrication method thereof

Chip package and fabrication method thereof

Stacked chip package and method for forming the same

Chip package

Chip scale sensing chip package and a manufacturing method thereof

Sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Sensing module and method for forming the same

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Method for forming chip package

Chip package and method for forming the same

Semiconductor chip package and method for manufacturing thereof

Chip package having sensing element and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package including recess in side edge

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Chip package and fabrication method thereof

Chip package and power module

Chip package and method for forming the same

Chip package

Semiconductor structure with sensor chip and landing pads

Wafer level array of chips and method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region

Chip package and method for forming the same

YEN YU-LIN

Chip package

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Chip package

Chip package

Chip package and method for forming the same

TAIWAN SEMICONDUCTOR MFG

High aspect ratio gap fill application using high density plasma chemical vapor deposition

Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation

LEE HUNG-JEN

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

LOU BAI-YAO

Chip package and method for forming the same

Chip package and method for fabricating the same

TSAI CHIA-LUN

Chip package and fabrication method thereof

HUANG YU-LUNG

Chip package and fabrication method thereof

LIU TSANG-YU

Chip package and method for fabricating the same