Inventor

HO YEN-SHIH

TW87 patents

⚠️ This page may combine multiple inventors who share the name “HO YEN-SHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO YEN-SHIH

XINTEC INC

Electronic device package and fabrication method thereof

Stacked chip package and method for forming the same

Chip scale sensing chip package and a manufacturing method thereof

Sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Method for forming chip package

Chip package and method for forming the same

Semiconductor chip package and method for manufacturing thereof

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package including recess in side edge

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Chip package and method for forming the same

Chip package

Semiconductor structure with sensor chip and landing pads

IC wafer having electromagnetic shielding effects and method for making the same

Chip package structure and manufacturing method thereof

Chip package and method thereof

Manufacturing method of chip package

Chip package and method for forming the same

Photosensitive module and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Manufacturing method of semiconductor structure

Chip package and method thereof

TAIWAN SEMICONDUCTOR MFG

Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow

Dual damascene interconnect structures that include radio frequency capacitors and inductors

Method of fabricating a planar spiral inductor structure having an enhanced Q value

Uniform sidewall profile etch method for forming low contact leakage schottky diode contact

Method of making a metal-insulator-metal capacitor in the CMOS process

Method of increasing end point detection capability of reactive ion etching by adding pad area

Planar spiral inductor structure with patterned microelectronic structure integral thereto

Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer

Planar spiral inductor structure having enhanced Q value

Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer

Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process

Method for manufacturing a silicide to silicide capacitor

LEE HUNG-JEN

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

YEN YU-LIN

Chip package and manufacturing method thereof

Chip package and method for forming the same

VANGUARD INT SEMICONDUCT CORP

Photonic integrated circuit structure and fabrication method thereof

Structure of transferring dies for use in mass transferring process

HUANG YU-LUNG

Image sensor chip package and method for forming the same