Inventor

JUN SEUNG-HO

KR2 patents

Patents

2 patents

US5843850ADec 1, 1998

Method of stripping a nitride layer from a wafer and wet etching apparatus using the same

SAMSUNG ELECTRONICS CO LTD10 citations67

US6021786AFeb 8, 2000

Wafer treatment method using hydrophilic making fluid supply

SAMSUNG ELECTRONICS CO LTD8 citations65