Inventor
KIM GEUNWOO
KR24 patents
⚠️ This page may combine multiple inventors who share the name “KIM GEUNWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
22 patentsUS11955487B2Apr 9, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations72
US11417656B2Aug 16, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US11239334B2Feb 1, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations72
US11631769B2Apr 18, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations71
US10804158B2Oct 13, 2020
Methods of fabricating semiconductor devices including differing barrier layer structures
SAMSUNG ELECTRONICS CO LTD3 citations71
US11552392B2Jan 10, 2023
Electronic device including antenna module
SAMSUNG ELECTRONICS CO LTD5 citations70
US10147616B2Dec 4, 2018
Package frame and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations66
US12183742B2Dec 31, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11682706B2Jun 20, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11837645B2Dec 5, 2023
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11830874B2Nov 28, 2023
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11538916B2Dec 27, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11233050B2Jan 25, 2022
Semiconductor device with diffusion barrier in the active contact
SAMSUNG ELECTRONICS CO LTD0 citations61
US12419086B2Sep 16, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12568865B2Mar 3, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11469188B2Oct 11, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11405069B2Aug 2, 2022
Electronic device and method for transmitting uplink reference signal
SAMSUNG ELECTRONICS CO LTD0 citations51
US12230682B2Feb 18, 2025
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations50
US10593597B2Mar 17, 2020
Methods of fabricating semiconductor devices including differing barrier layer structures
SAMSUNG ELECTRONICS CO LTD0 citations50
US12406917B2Sep 2, 2025
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations45
US11668782B2Jun 6, 2023
Electronic apparatus, controlling method of electronic apparatus and computer readable medium
SAMSUNG ELECTRONICS CO LTD0 citations45
US12126685B2Oct 22, 2024
Network connection method and electronic device supporting same
SAMSUNG ELECTRONICS CO LTD0 citations36