Inventor
IGA HAYATO
JP16 patents
Patents
16 patentsUS12289922B2Apr 29, 2025
Processing method
DISCO CORP2 citations72
US12202173B2Jan 21, 2025
Method of manufacturing monocrystalline silicon substrate
DISCO CORP2 citations72
US12593642B2Mar 31, 2026
Method of processing a wafer
DISCO CORP0 citations51
US12538762B2Jan 27, 2026
Processing method of bonded wafer
DISCO CORP0 citations51
US12538763B2Jan 27, 2026
Bonded wafer processing method
DISCO CORP0 citations51
US12532715B2Jan 20, 2026
Processing method of bonded wafer
DISCO CORP0 citations51
US12560557B2Feb 24, 2026
Inspection method of workpiece and inspection apparatus
DISCO CORP0 citations49
US12454076B2Oct 28, 2025
Substrate manufacturing method
DISCO CORP0 citations49
US12447560B2Oct 21, 2025
Manufacturing method of single crystal silicon substrate
DISCO CORP0 citations49
US12354916B2Jul 8, 2025
Method of processing wafer
DISCO CORP0 citations49
US12311470B2May 27, 2025
Method of processing monocrystalline silicon wafer
DISCO CORP0 citations49
US12214526B2Feb 4, 2025
Method of manufacturing substrate
DISCO CORP0 citations49
US12129570B2Oct 29, 2024
Manufacturing method of single-crystal silicon substrate
DISCO CORP0 citations49
US12533830B2Jan 27, 2026
Substrate manufacturing method
DISCO CORP0 citations47
US12479048B2Nov 25, 2025
Wafer processing apparatus
DISCO CORP0 citations45
US12459147B2Nov 4, 2025
Cutting apparatus
DISCO CORP0 citations44