Inventor
TOH TUCK FOOK
SG4 patents
Patents
4 patentsUS6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6091140AJul 18, 2000
Thin chip-size integrated circuit package
TEXAS INSTRUMENTS INC114 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95