Inventor

KE YING-CHIEH

TW2 patents

Patents

2 patents

US11646302B2May 9, 2023

Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

APPLE INC4 citations70

US12249599B2Mar 11, 2025

Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

APPLE INC0 citations58