P

Inventor

NGUYEN BICH-YEN

US134 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN BICH-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

28 patents
US6297095B1Oct 2, 2001

Memory device that includes passivated nanoclusters and method for manufacture

MOTOROLA INC284 citations99
US6413819B1Jul 2, 2002

Memory device and method for using prefabricated isolated storage elements

MOTOROLA INC128 citations98
US6362071B1Mar 26, 2002

Method for forming a semiconductor device with an opening in a dielectric layer

MOTOROLA INC149 citations98
US6184072B1Feb 6, 2001

Process for forming a high-K gate dielectric

MOTOROLA INC224 citations98
US5219793AJun 15, 1993

Method for forming pitch independent contacts and a semiconductor device having the same

MOTOROLA INC149 citations98
US6518634B1Feb 11, 2003

Strontium nitride or strontium oxynitride gate dielectric

MOTOROLA INC79 citations97
US6444512B1Sep 3, 2002

Dual metal gate transistors for CMOS process

MOTOROLA INC96 citations97
US4987102AJan 22, 1991

Process for forming high purity thin films

MOTOROLA INC432 citations97
US6541280B2Apr 1, 2003

High K dielectric film

MOTOROLA INC190 citations96
US6518106B2Feb 11, 2003

Semiconductor device and a method therefor

MOTOROLA INC100 citations96
US6344403B1Feb 5, 2002

Memory device and method for manufacture

MOTOROLA INC142 citations96
US5538922AJul 23, 1996

Method for forming contact to a semiconductor device

MOTOROLA INC74 citations96
US5539249AJul 23, 1996

Method and structure for forming an integrated circuit pattern on a semiconductor substrate

MOTOROLA INC36 citations96
US5510278AApr 23, 1996

Method for forming a thin film transistor

MOTOROLA INC67 citations96
US5408130AApr 18, 1995

Interconnection structure for conductive layers

MOTOROLA INC86 citations96
US5378659AJan 3, 1995

Method and structure for forming an integrated circuit pattern on a semiconductor substrate

MOTOROLA INC69 citations96
US5262352ANov 16, 1993

Method for forming an interconnection structure for conductive layers

MOTOROLA INC92 citations96
US4890144ADec 26, 1989

Integrated circuit trench cell

MOTOROLA INC140 citations96
US5897343AApr 27, 1999

Method of making a power switching trench MOSFET having aligned source regions

MOTOROLA INC119 citations95
US4897364AJan 30, 1990

Method for locos isolation using a framed oxidation mask and a polysilicon buffer layer

MOTOROLA INC57 citations95
US5639687AJun 17, 1997

Method for forming an integrated circuit pattern on a semiconductor substrate using silicon-rich silicon nitride

MOTOROLA INC90 citations93
US5300187AApr 5, 1994

Method of removing contaminants

MOTOROLA INC66 citations93
US4693781ASep 15, 1987

Trench formation process

MOTOROLA INC73 citations93
US6545324B2Apr 8, 2003

Dual metal gate transistors for CMOS process

MOTOROLA INC35 citations92
US5567958AOct 22, 1996

High-performance thin-film transistor and SRAM memory cell

MOTOROLA INC21 citations92
US5543635AAug 6, 1996

Thin film transistor and method of formation

MOTOROLA INC20 citations92
US5235189AAug 10, 1993

Thin film transistor having a self-aligned gate underlying a channel region

MOTOROLA INC22 citations92
US6576967B1Jun 10, 2003

Semiconductor structure and process for forming a metal oxy-nitride dielectric layer

MOTOROLA INC28 citations91

FREESCALE SEMICONDUCTOR INC

21 patents
US7226833B2Jun 5, 2007

Semiconductor device structure and method therefor

FREESCALE SEMICONDUCTOR INC124 citations99
US6838322B2Jan 4, 2005

Method for forming a double-gated semiconductor device

FREESCALE SEMICONDUCTOR INC259 citations98
US7575968B2Aug 18, 2009

Inverse slope isolation and dual surface orientation integration

FREESCALE SEMICONDUCTOR INC533 citations97
US7282402B2Oct 16, 2007

Method of making a dual strained channel semiconductor device

FREESCALE SEMICONDUCTOR INC69 citations97
US7018901B1Mar 28, 2006

Method for forming a semiconductor device having a strained channel and a heterojunction source/drain

FREESCALE SEMICONDUCTOR INC105 citations97
US6831350B1Dec 14, 2004

Semiconductor structure with different lattice constant materials and method for forming the same

FREESCALE SEMICONDUCTOR INC89 citations97
US7494856B2Feb 24, 2009

Semiconductor fabrication process using etch stop layer to optimize formation of source/drain stressor

FREESCALE SEMICONDUCTOR INC51 citations94
US6770923B2Aug 3, 2004

High K dielectric film

FREESCALE SEMICONDUCTOR INC115 citations94
US7585735B2Sep 8, 2009

Asymmetric spacers and asymmetric source/drain extension layers

FREESCALE SEMICONDUCTOR INC33 citations93
US7575975B2Aug 18, 2009

Method for forming a planar and vertical semiconductor structure having a strained semiconductor layer

FREESCALE SEMICONDUCTOR INC34 citations93
US7524707B2Apr 28, 2009

Modified hybrid orientation technology

FREESCALE SEMICONDUCTOR INC19 citations93
US7446026B2Nov 4, 2008

Method of forming a CMOS device with stressor source/drain regions

FREESCALE SEMICONDUCTOR INC29 citations93
US7226820B2Jun 5, 2007

Transistor fabrication using double etch/refill process

FREESCALE SEMICONDUCTOR INC34 citations93
US7037795B1May 2, 2006

Low RC product transistors in SOI semiconductor process

FREESCALE SEMICONDUCTOR INC26 citations93
US7208357B2Apr 24, 2007

Template layer formation

FREESCALE SEMICONDUCTOR INC18 citations92
US7091071B2Aug 15, 2006

Semiconductor fabrication process including recessed source/drain regions in an SOI wafer

FREESCALE SEMICONDUCTOR INC22 citations92
US7067868B2Jun 27, 2006

Double gate device having a heterojunction source/drain and strained channel

FREESCALE SEMICONDUCTOR INC39 citations92
US7029980B2Apr 18, 2006

Method of manufacturing SOI template layer

FREESCALE SEMICONDUCTOR INC25 citations92
US6979622B1Dec 27, 2005

Semiconductor transistor having structural elements of differing materials and method of formation

FREESCALE SEMICONDUCTOR INC21 citations92
US6794281B2Sep 21, 2004

Dual metal gate transistors for CMOS process

FREESCALE SEMICONDUCTOR INC47 citations92
US6951783B2Oct 4, 2005

Confined spacers for double gate transistor semiconductor fabrication process

FREESCALE SEMICONDUCTOR INC23 citations91

NGUYEN BICH-YEN

1 patent

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