Inventor

LIN CHIEF

TW3 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHIEF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KINGPAK TECH INC

1 patent

US6642554B2Nov 4, 2003

Memory module structure

KINGPAK TECH INC2 citations54

HSIN CHUNG HSIEN

1 patent

US8314481B2Nov 20, 2012

Substrate structure for an image sensor package and method for manufacturing the same

HSIN CHUNG HSIEN0 citations45

(unassigned)

1 patent

US6501187B1Dec 31, 2002

Semiconductor package structure having central leads and method for packaging the same

1 citations45