Inventor

HOU PO-KAI

TW2 patents

Patents

2 patents

US7812432B2Oct 12, 2010

Chip package with a dam structure on a die pad

CHIPMOS TECHNOLOGIES INC13 citations75

US7842550B2Nov 30, 2010

Method of fabricating quad flat non-leaded package

CHIPMOS TECHNOLOGIES INC0 citations48