Inventor
SHIH CHI-JIN
TW3 patents
Patents
3 patentsUS7812432B2Oct 12, 2010
Chip package with a dam structure on a die pad
CHIPMOS TECHNOLOGIES INC13 citations75
US9401318B2Jul 26, 2016
Quad flat no-lead package and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC3 citations66
US9318422B2Apr 19, 2016
Flat no-lead package and the manufacturing method thereof
CHIPMOS TECHNOLOGIES INC1 citations45