Inventor

NODDIN DAVID B

US19 patents

⚠️ This page may combine multiple inventors who share the name “NODDIN DAVID B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NODDIN DAVID B

GORE & ASS

Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias

Semiconductor flip chip package

Multiple pulse space processing to enhance via entrance formation at 355 nm

Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias

Laser apparatus having improved via processing rate

Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation

Multiple frequency processing to improve electrical resistivity of blind micro-vias

Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias

Method of increasing package reliability by designing in plane CTE gradients

Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance

Constraining ring for use in electronic packaging

Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly

Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques

Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit

Constraining ring for use in electronic packaging

ROGERS CORP

Method of laser drilling fluoropolymer materials

(unassigned)

Constraining ring for use in electronic packaging

W L GORE & ASSSOCIATES INC

Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias

SUPERCOMPUTER SYSTEMS LTD

Multilayer interconnect system for an area array interconnection using solid state diffusion