Inventor

SOUNDARAPANDIAN MOHANRAJ

SG2 patents

Patents

2 patents

US7183176B2Feb 27, 2007

Method of forming through-wafer interconnects for vertical wafer level packaging

AGENCY SCIENCE TECH & RES57 citations92

US7381629B2Jun 3, 2008

Method of forming through-wafer interconnects for vertical wafer level packaging

AGENCY SCIENCE TECH & RES3 citations58