Inventor

LIU KUO-HUA

TW3 patents

⚠️ This page may combine multiple inventors who share the name “LIU KUO-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XINTEC INC

2 patents

US8748926B2Jun 10, 2014

Chip package with multiple spacers and method for forming the same

XINTEC INC4 citations70

US8993365B2Mar 31, 2015

Wafer packaging method

XINTEC INC0 citations33

YEN YU-LIN

1 patent

US9136241B2Sep 15, 2015

Chip package and manufacturing method thereof

YEN YU-LIN4 citations71