Inventor
UTSUMI MASAKI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “UTSUMI MASAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC CORP
9 patentsUS7859084B2Dec 28, 2010
Semiconductor substrate
PANASONIC CORP124 citations97
US7838323B2Nov 23, 2010
Method for fabricating semiconductor device
PANASONIC CORP114 citations97
US7453128B2Nov 18, 2008
Semiconductor device and method for fabricating the same
PANASONIC CORP54 citations95
US7777311B2Aug 17, 2010
Circuit substrate, molding semiconductor device, tray and inspection socket
PANASONIC CORP21 citations88
US9673154B2Jun 6, 2017
Semiconductor device
PANASONIC CORP7 citations83
US8710595B2Apr 29, 2014
Semiconductor device
PANASONIC CORP4 citations83
US7948039B2May 24, 2011
Semiconductor device and method for fabricating the same
PANASONIC CORP5 citations73
US9082779B2Jul 14, 2015
Semiconductor device
PANASONIC CORP2 citations62
US7994589B2Aug 9, 2011
Semiconductor device and method for fabricating the same
PANASONIC CORP0 citations51
TOSHIBA KK
3 patentsUS6195677B1Feb 27, 2001
Distributed network computing system for data exchange/conversion between terminals
TOSHIBA KK141 citations97
US5966451AOct 12, 1999
Distributed network computing system, and data exchange apparatus and method and storage medium used in this system
TOSHIBA KK93 citations97
US6457040B1Sep 24, 2002
Method and system for a distributed network computing system for providing application services
TOSHIBA KK53 citations88
TSUTSUE MAKOTO
2 patentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
2 patentsUS6835600B2Dec 28, 2004
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations72
US6603194B2Aug 5, 2003
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations72