P

Inventor

YAHATA TAKASHI

JP35 patents
⚠️ This page may combine multiple inventors who share the name “YAHATA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

16 patents
US11495435B2Nov 8, 2022

Substrate processing apparatus, non-transitory computer-readable recording medium, method of manufacturing semiconductor device, and a substrate processing method

KOKUSAI ELECTRIC CORP2 citations73
US11145505B1Oct 12, 2021

Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP5 citations73
US10914005B2Feb 9, 2021

Substrate processing apparatus having gas guide capable of suppressing gas diffusion

KOKUSAI ELECTRIC CORP2 citations73
US10453720B1Oct 22, 2019

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP3 citations72
US12385139B2Aug 12, 2025

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations62
US12136545B2Nov 5, 2024

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11961715B2Apr 16, 2024

Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations62
US11891697B2Feb 6, 2024

Substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations62
US11359285B2Jun 14, 2022

Substrate processing apparatus, heater and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations62
US11305986B2Apr 19, 2022

Method of manufacturing semiconductor device, substrate processing apparatus and program

KOKUSAI ELECTRIC CORP0 citations62
US11289350B2Mar 29, 2022

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP1 citations61
US10796934B2Oct 6, 2020

Substrate processing apparatus, method of manufacturing semiconductor device and electrode fixing part

KOKUSAI ELECTRIC CORP1 citations61
US11990347B2May 21, 2024

Method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations52
US11264217B2Mar 1, 2022

Substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations52
US10541170B2Jan 21, 2020

Substrate processing apparatus and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations52
US10633739B2Apr 28, 2020

Substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations41

CASIO COMPUTER CO LTD

9 patents

HITACHI INT ELECTRIC INC

7 patents

YAHATA TAKASHI

1 patent

HITACHI LTD

1 patent

RENASCIENCE CO LTD

1 patent