Inventor
AOKI HIDEJI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “AOKI HIDEJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
9 patentsUS5520276AMay 28, 1996
Method and apparatus for carrying and locating sheet frame
MITSUBISHI ELECTRIC CORP27 citations88
US5587633ADec 24, 1996
Press control method and press apparatus
MITSUBISHI ELECTRIC CORP46 citations86
US5177992AJan 12, 1993
Device for feeding thin-web frame
MITSUBISHI ELECTRIC CORP11 citations73
US6530764B2Mar 11, 2003
Mold for resin-sealing of semiconductor devices
MITSUBISHI ELECTRIC CORP9 citations69
US6363976B1Apr 2, 2002
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP8 citations69
US6337042B1Jan 8, 2002
Press machine and method of manufacturing pressed products
MITSUBISHI ELECTRIC CORP12 citations69
US5842257ADec 1, 1998
Apparatus for and method of fabricating semiconductor devices
MITSUBISHI ELECTRIC CORP9 citations69
US5636127AJun 3, 1997
Method and apparatus for carrying and locating sheet frame
MITSUBISHI ELECTRIC CORP11 citations69
US6242287B1Jun 5, 2001
Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin
MITSUBISHI ELECTRIC CORP10 citations66
FUJITSU LTD
4 patentsUS4626960ADec 2, 1986
Semiconductor device having soldered bond between base and cap thereof
FUJITSU LTD49 citations92
US4458291AJul 3, 1984
Package for enclosing semiconductor elements
FUJITSU LTD36 citations88
US4590672AMay 27, 1986
Package for electronic device and method for producing same
FUJITSU LTD10 citations68
US4558346ADec 10, 1985
Highly reliable hermetically sealed package for a semiconductor device
FUJITSU LTD13 citations68