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Inventor
BECKHAM KEITH F
US
2 patents
Patents
2 patents
US4604644A
Aug 5, 1986
Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
IBM
396 citations
95
US4962294A
Oct 9, 1990
Method and apparatus for causing an open circuit in a conductive line
IBM
17 citations
71