Inventor
SUGIARTO DIAN
US23 patents
⚠️ This page may combine multiple inventors who share the name “SUGIARTO DIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
22 patentsUS6764958B1Jul 20, 2004
Method of depositing dielectric films
APPLIED MATERIALS INC314 citations98
US6486082B1Nov 26, 2002
CVD plasma assisted lower dielectric constant sicoh film
APPLIED MATERIALS INC80 citations98
US6077764AJun 20, 2000
Process for depositing high deposition rate halogen-doped silicon oxide layer
APPLIED MATERIALS INC91 citations98
US6258735B1Jul 10, 2001
Method for using bypass lines to stabilize gas flow and maintain plasma inside a deposition chamber
APPLIED MATERIALS INC84 citations97
US6204168B1Mar 20, 2001
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC113 citations97
US5885751AMar 23, 1999
Method and apparatus for depositing deep UV photoresist films
APPLIED MATERIALS INC46 citations96
US6514857B1Feb 4, 2003
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC57 citations95
US7745328B2Jun 29, 2010
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC12 citations92
US7008484B2Mar 7, 2006
Method and apparatus for deposition of low dielectric constant materials
APPLIED MATERIALS INC19 citations92
US6838393B2Jan 4, 2005
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
APPLIED MATERIALS INC24 citations92
US6632735B2Oct 14, 2003
Method of depositing low dielectric constant carbon doped silicon oxide
APPLIED MATERIALS INC37 citations92
US6395092B1May 28, 2002
Apparatus for depositing high deposition rate halogen-doped silicon oxide layer
APPLIED MATERIALS INC30 citations92
US6825562B2Nov 30, 2004
Damascene structure fabricated using a layer of silicon-based photoresist material
APPLIED MATERIALS INC14 citations91
US6090530AJul 18, 2000
Method and apparatus for depositing deep UV photoresist films
APPLIED MATERIALS INC15 citations82
US6943127B2Sep 13, 2005
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC6 citations74
US7465659B2Dec 16, 2008
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC8 citations73
US7157384B2Jan 2, 2007
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC7 citations73
US7117064B2Oct 3, 2006
Method of depositing dielectric films
APPLIED MATERIALS INC5 citations73
US7001850B2Feb 21, 2006
Method of depositing dielectric films
APPLIED MATERIALS INC7 citations73
US6238844B1May 29, 2001
Process for depositing a plasma polymerized organosilicon photoresist film
APPLIED MATERIALS INC11 citations73
US7153787B2Dec 26, 2006
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC3 citations63
US6911403B2Jun 28, 2005
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
APPLIED MATERIALS INC5 citations63