Inventor
OSADA MICHIO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “OSADA MICHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOWA CORP
13 patentsUS5834035ANov 10, 1998
Method of and apparatus for molding resin to seal electronic parts
TOWA CORP91 citations95
US5603879AFeb 18, 1997
Method of molding resin to seal electronic parts using two evacuation steps
TOWA CORP48 citations95
US5435953AJul 25, 1995
Method of molding resin for sealing an electronic device
TOWA CORP76 citations95
US5874324AFeb 23, 1999
Method of sealing electronic component with molded resin
TOWA CORP30 citations92
US5507633AApr 16, 1996
Resin molding apparatus for sealing an electronic device
TOWA CORP36 citations92
US6773247B1Aug 10, 2004
Die used for resin-sealing and molding an electronic component
TOWA CORP31 citations90
US6919223B2Jul 19, 2005
Method of manufacturing semiconductor resin molding and resin member employed therefor
TOWA CORP13 citations84
US5783220AJul 21, 1998
Resin sealing and molding apparatus for sealing electronic parts
TOWA CORP19 citations84
US6736703B2May 18, 2004
Cutting apparatus and cutting method
TOWA CORP8 citations73
US6438826B2Aug 27, 2002
Electronic component, method of sealing electronic component with resin, and apparatus therefor
TOWA CORP13 citations72
US6712674B2Mar 30, 2004
Polishing apparatus and polishing method
TOWA CORP4 citations62
US6594889B1Jul 22, 2003
Method for processing leadframe
TOWA CORP2 citations57
US6258628B1Jul 10, 2001
Method and apparatus for processing resin sealed lead frame
TOWA CORP3 citations56
OSADA MICHIO
3 patentsUS4862586ASep 5, 1989
Lead frame for enclosing semiconductor chips with resin
OSADA MICHIO31 citations92
US4793785ADec 27, 1988
Apparatus of multiplunger type for enclosing semiconductor elements with resin
OSADA MICHIO55 citations92
US4723899AFeb 9, 1988
Molding apparatus for enclosing semiconductor chips with resin
OSADA MICHIO33 citations92