Inventor
YOSHIOKA JUNICHIRO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIOKA JUNICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
20 patentsUS6844274B2Jan 18, 2005
Substrate holder, plating apparatus, and plating method
EBARA CORP39 citations96
US7022211B2Apr 4, 2006
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP47 citations95
US7601248B2Oct 13, 2009
Substrate holder and plating apparatus
EBARA CORP11 citations92
US6269548B1Aug 7, 2001
Spin processing apparatus
EBARA CORP22 citations92
US7402227B2Jul 22, 2008
Plating apparatus and method
EBARA CORP34 citations91
US6716332B1Apr 6, 2004
Plating method and apparatus
EBARA CORP31 citations91
US7833393B2Nov 16, 2010
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP11 citations83
US6365020B1Apr 2, 2002
Wafer plating jig
EBARA CORP14 citations82
US7901551B2Mar 8, 2011
Substrate holder and plating apparatus
EBARA CORP5 citations73
US7807027B2Oct 5, 2010
Substrate holder, plating apparatus, and plating method
EBARA CORP6 citations73
US9714476B2Jul 25, 2017
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP2 citations72
US9624596B2Apr 18, 2017
Electrochemical deposition method
EBARA CORP3 citations72
US6500317B1Dec 31, 2002
Plating apparatus for detecting the conductivity between plating contacts on a substrate
EBARA CORP8 citations72
US9388505B2Jul 12, 2016
Electrochemical deposition method
EBARA CORP1 citations62
US8936705B2Jan 20, 2015
Electrochemical deposition apparatus
EBARA CORP1 citations62
US8012332B2Sep 6, 2011
Plating apparatus and method
EBARA CORP4 citations61
US6242624B1Jun 5, 2001
Method for making alkanol-or alkane-sulfone plumbate
EBARA CORP4 citations57
US9593430B2Mar 14, 2017
Electrochemical deposition method
EBARA CORP1 citations51
US9506162B2Nov 29, 2016
Electrochemical deposition method
EBARA CORP0 citations51
US7118664B2Oct 10, 2006
Plating method and apparatus
EBARA CORP1 citations51
YOSHIOKA JUNICHIRO
4 patentsUS8337680B2Dec 25, 2012
Substrate holder and plating apparatus
YOSHIOKA JUNICHIRO3 citations71
US8961755B2Feb 24, 2015
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
YOSHIOKA JUNICHIRO2 citations60
US8133376B2Mar 13, 2012
Substrate holder, plating apparatus, and plating method
YOSHIOKA JUNICHIRO0 citations50
US8075756B2Dec 13, 2011
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
YOSHIOKA JUNICHIRO0 citations50