Inventor
KIM SEOK HO
US43 patents
⚠️ This page may combine multiple inventors who share the name “KIM SEOK HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS9941243B2Apr 10, 2018
Wafer-to-wafer bonding structure
SAMSUNG ELECTRONICS CO LTD237 citations99
US9865581B2Jan 9, 2018
Method of fabricating multi-substrate semiconductor devices
SAMSUNG ELECTRONICS CO LTD25 citations93
US9520361B2Dec 13, 2016
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD28 citations93
US10468400B2Nov 5, 2019
Method of manufacturing substrate structure
SAMSUNG ELECTRONICS CO LTD8 citations84
US9935037B2Apr 3, 2018
Multi-stacked device having TSV structure
SAMSUNG ELECTRONICS CO LTD13 citations84
US12170259B2Dec 17, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations74
US10325897B2Jun 18, 2019
Method for fabricating substrate structure and substrate structure fabricated by using the method
SAMSUNG ELECTRONICS CO LTD4 citations73
US10639875B2May 5, 2020
Wafer bonding apparatus and wafer bonding system including the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US9287251B2Mar 15, 2016
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US11283235B2Mar 22, 2022
Semiconductor laser device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10763243B2Sep 1, 2020
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD1 citations60
US7663786B2Feb 16, 2010
Image-forming apparatus and method of controlling operations in automatic document feeder mode thereof
SAMSUNG ELECTRONICS CO LTD2 citations58
US11417536B2Aug 16, 2022
Method for wafer planarization and an image sensor made by the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10770447B2Sep 8, 2020
Method for fabricating substrate structure and substrate structure fabricated by using the method
SAMSUNG ELECTRONICS CO LTD0 citations52
US12543541B2Feb 3, 2026
Semiconductor package with nanotwin copper bond pads
SAMSUNG ELECTRONICS CO LTD0 citations50
US11728200B2Aug 15, 2023
Wafer bonding apparatuses
SAMSUNG ELECTRONICS CO LTD0 citations50