P

Inventor

KIM SEOK HO

US43 patents
⚠️ This page may combine multiple inventors who share the name “KIM SEOK HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US9941243B2Apr 10, 2018

Wafer-to-wafer bonding structure

SAMSUNG ELECTRONICS CO LTD237 citations99
US9865581B2Jan 9, 2018

Method of fabricating multi-substrate semiconductor devices

SAMSUNG ELECTRONICS CO LTD25 citations93
US9520361B2Dec 13, 2016

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD28 citations93
US10468400B2Nov 5, 2019

Method of manufacturing substrate structure

SAMSUNG ELECTRONICS CO LTD8 citations84
US9935037B2Apr 3, 2018

Multi-stacked device having TSV structure

SAMSUNG ELECTRONICS CO LTD13 citations84
US12170259B2Dec 17, 2024

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations74
US10325897B2Jun 18, 2019

Method for fabricating substrate structure and substrate structure fabricated by using the method

SAMSUNG ELECTRONICS CO LTD4 citations73
US10639875B2May 5, 2020

Wafer bonding apparatus and wafer bonding system including the same

SAMSUNG ELECTRONICS CO LTD6 citations72
US9287251B2Mar 15, 2016

Method of manufacturing a semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations72
US11283235B2Mar 22, 2022

Semiconductor laser device

SAMSUNG ELECTRONICS CO LTD0 citations61
US10763243B2Sep 1, 2020

Substrate bonding apparatus

SAMSUNG ELECTRONICS CO LTD1 citations60
US7663786B2Feb 16, 2010

Image-forming apparatus and method of controlling operations in automatic document feeder mode thereof

SAMSUNG ELECTRONICS CO LTD2 citations58
US11417536B2Aug 16, 2022

Method for wafer planarization and an image sensor made by the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US10770447B2Sep 8, 2020

Method for fabricating substrate structure and substrate structure fabricated by using the method

SAMSUNG ELECTRONICS CO LTD0 citations52
US12543541B2Feb 3, 2026

Semiconductor package with nanotwin copper bond pads

SAMSUNG ELECTRONICS CO LTD0 citations50
US11728200B2Aug 15, 2023

Wafer bonding apparatuses

SAMSUNG ELECTRONICS CO LTD0 citations50

NAM GUENG HYUN

3 patents

COMBASIS TECHNOLOGY INC

2 patents

GLOBAL BATTERY CO LTD

2 patents

LEE JONG RIP

2 patents

HUGHES AIRCRAFT CO

1 patent

HUGHES ELECTRONICS CORP

1 patent

CLAIRCOM COMMUNICATIONS GROUP

1 patent

SYMBOL TECHNOLOGIES INC

1 patent

KIM SEOK-HO

1 patent

JO CHA-JEA

1 patent

KIM KI-HYUK

1 patent

PARK MYEONG-SOON

1 patent

KOREA RES INST BIOSCIENCE & BIOTECHNOLOGY

1 patent

HA HONG SOO

1 patent

KOREA ELECTROTECH RES INST

1 patent

SAMSUNG CORP

1 patent

S PRINTING SOLUTION CO LTD

1 patent

KIM SEOK HO

1 patent

GWANGJU INST SCIENCE & TECH

1 patent

KWANGJU INST SCI & TECH

1 patent

PARK DONG HYUN

1 patent

HA HONG-SOO

1 patent