Inventor
GEORGE LEGAL REPRESENTATIVE AN
US11 patents
Patents
11 patentsUS7420273B2Sep 2, 2008
Thinned die integrated circuit package
INTEL CORP63 citations98
US7226812B2Jun 5, 2007
Wafer support and release in wafer processing
INTEL CORP63 citations97
US6977435B2Dec 20, 2005
Thick metal layer integrated process flow to improve power delivery and mechanical buffering
INTEL CORP82 citations94
US7236666B2Jun 26, 2007
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
INTEL CORP19 citations92
US7042106B2May 9, 2006
Underfill integration for optical packages
INTEL CORP16 citations92
US7372120B1May 13, 2008
Methods and apparatus to optically couple an optoelectronic chip to a waveguide
INTEL CORP16 citations84
US7256059B2Aug 14, 2007
Underfill integration for optical packages
INTEL CORP11 citations84
US7177504B2Feb 13, 2007
Manufacturable connectorization process for optical chip-to-chip interconnects
INTEL CORP18 citations84
US7369718B2May 6, 2008
Package substrate pattern to accommodate optical waveguide
INTEL CORP11 citations83
US7085449B2Aug 1, 2006
Waveguide coupling mechanism
INTEL CORP0 citations52
US7012015B2Mar 14, 2006
Wafer-level thick film standing-wave clocking
INTEL CORP1 citations52