Inventor
HWANG TAE-HOE
KR2 patents
Patents
2 patentsUS7374966B2May 20, 2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations69
US7135353B2Nov 14, 2006
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations58