Inventor
HAN CHUNG CHYUNG (JUSTIN)
US2 patents
Patents
2 patentsUS9768144B2Sep 19, 2017
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
MARVELL WORLD TRADE LTD11 citations83
US9391045B2Jul 12, 2016
Recessed semiconductor substrates and associated techniques
MARVELL WORLD TRADE LTD0 citations51