Inventor
TAN TEK SENG
MY5 patents
Patents
5 patentsUS7651938B2Jan 26, 2010
Void reduction in indium thermal interface material
ADVANCED MICRO DEVICES INC15 citations90
US7622311B1Nov 24, 2009
Inspection of underfill in integrated circuit package
ADVANCED MICRO DEVICES INC19 citations84
US7999394B2Aug 16, 2011
Void reduction in indium thermal interface material
ADVANCED MICRO DEVICES INC10 citations82
US7256065B1Aug 14, 2007
Methods and fixture for coupling a lid to a support substrate
ADVANCED MICRO DEVICES INC13 citations78
US7256067B1Aug 14, 2007
LGA fixture for indium assembly process
ADVANCED MICRO DEVICES INC9 citations69