Inventor

LIU DUIXIAN

US98 patents

⚠️ This page may combine multiple inventors who share the name “LIU DUIXIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU DUIXIAN

IBM

Integrated antenna for laptop applications

Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips

Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

Integrated tri-band antenna for laptop applications

Integrated antenna for laptop applications

Antenna-in-package structures with broadside and end-fire radiations

Antenna-in-package structures with broadside and end-fire radiations

Wireless communications package with integrated antennas and air cavity

Millimeter-wave radio frequency integrated circuit packages with integrated antennas

Integrated antenna for RFIC package applications

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Apparatus and method for constructing and packaging printed antenna devices

Display device, computer terminal, and antenna

AC power line network simulator

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Package structures to improve on-chip antenna performance

Antenna-in-package structures with broadside and end-fire radiations

Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies

Wireless communications package with integrated antennas and air cavity

Antenna-in-package structures with broadside and end-fire radiations

Closely coupled directional antenna

Millimeter-wave communications on a multifunction platform

Wafer-scale phased array

Wireless communications package with integrated antenna array

Integration of area efficient antennas for phased array or wafer scale array antenna applications

Versatile Si-based packaging with integrated passive components for mmWave applications

Versatile Si-based packaging with integrated passive components for mmWave applications

Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Omnidirectional dipole antenna

Apparatus and methods for constructing and packaging printed antenna devices

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

Method and apparatus for packaging an integrated chip and antenna

Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production

Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities

Antenna array feed line structures for millimeter wave applications

Integrated antenna array packaging structures and methods

Antenna-in-package structures with broadside and end-fire radiations

Phased-array transceiver

LENOVO SINGAPORE PTE LTD

Antennas encapsulated within plastic display covers of computing devices

Integrated multiband antennas for computing devices

Low-profile embedded antenna architectures for wireless devices

CHEN HO CHUNG

Simple radio frequency integrated circuit (RFIC) packages with integrated antennas

Compact millimeter wave packages with integrated antennas

KAM DONG G

Integrated antenna for RFIC package applications

VALOR ETS

Antenna coupler for portable cellular telephones

LIU DUIXIAN

Wafer-scale package structures with integrated antennas

INTERNAITONAL BUSINESS MACHINE

Modified inverted-F antenna

LENOVA SINGAPORE PTE LTD

Quadband antenna for portable devices

GAYNES MICHAEL ANTHONY

Thermal interface material application for integrated circuit cooling