Inventor
FUJIMOTO HARRY
US9 patents
Patents
9 patentsUS6271469B1Aug 7, 2001
Direct build-up layer on an encapsulated die package
INTEL CORP711 citations99
US6562653B1May 13, 2003
Silicon interposer and multi-chip-module (MCM) with through substrate vias
INTEL CORP266 citations98
US6229216B1May 8, 2001
Silicon interposer and multi-chip-module (MCM) with through substrate vias
INTEL CORP307 citations98
US6154366ANov 28, 2000
Structures and processes for fabricating moisture resistant chip-on-flex packages
INTEL CORP496 citations98
US6509622B1Jan 21, 2003
Integrated circuit guard ring structures
INTEL CORP53 citations96
US6876053B1Apr 5, 2005
Isolation structure configurations for modifying stresses in semiconductor devices
INTEL CORP61 citations94
US6219243B1Apr 17, 2001
Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
INTEL CORP106 citations94
US7411269B2Aug 12, 2008
Isolation structure configurations for modifying stresses in semiconductor devices
INTEL CORP4 citations72
US7410858B2Aug 12, 2008
Isolation structure configurations for modifying stresses in semiconductor devices
INTEL CORP6 citations72