Inventor
LIN CHIH-SHENG
TW36 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIH-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
18 patentsUS9136843B2Sep 15, 2015
Through silicon via repair circuit of semiconductor device
IND TECH RES INST4 citations73
US11599600B2Mar 7, 2023
Computing in memory cell
IND TECH RES INST2 citations71
US11423983B2Aug 23, 2022
Memory device and data weight state determining method for in-memory computation
IND TECH RES INST2 citations71
US7738289B2Jun 15, 2010
Memory accessing circuit and method
IND TECH RES INST2 citations62
US12260321B2Mar 25, 2025
Data feature augmentation system and method for low-precision neural network
IND TECH RES INST0 citations61
US11145356B2Oct 12, 2021
Computation operator in memory and operation method thereof
IND TECH RES INST1 citations61
US10914618B2Feb 9, 2021
Readout circuit for sensor and readout method thereof
IND TECH RES INST0 citations61
US7486546B2Feb 3, 2009
Multi-state sense amplifier
IND TECH RES INST4 citations61
US7385866B2Jun 10, 2008
Load-balanced apparatus of memory
IND TECH RES INST6 citations61
US11741189B2Aug 29, 2023
Computing in memory cell
IND TECH RES INST0 citations60
US9368271B2Jun 14, 2016
Three-dimension symmetrical vertical transformer
IND TECH RES INST1 citations51
US12406721B2Sep 2, 2025
Memory cell
IND TECH RES INST0 citations50
US12142342B2Nov 12, 2024
Memory circuit with sense amplifier calibration mechanism
IND TECH RES INST0 citations50
US10324054B2Jun 18, 2019
Method of manufacturing sensor device
IND TECH RES INST0 citations50
US10156535B2Dec 18, 2018
Sensor device and method of manufacturing the same
IND TECH RES INST0 citations50
US10101175B2Oct 16, 2018
Sensor interface circuit and sensor output adjusting method
IND TECH RES INST0 citations50
US9076771B2Jul 7, 2015
Varactor that applies bias voltage to two through wafer vias to determine capacitance of depletion region capacitor formed between the two through wafer vias
IND TECH RES INST1 citations50
US7894274B2Feb 22, 2011
Memories with improved write current
IND TECH RES INST0 citations40
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6147361ANov 14, 2000
Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity
TAIWAN SEMICONDUCTOR MFG30 citations92
US5627101AMay 6, 1997
Method of fabricating polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures
TAIWAN SEMICONDUCTOR MFG25 citations92
US5846848ADec 8, 1998
Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity
TAIWAN SEMICONDUCTOR MFG8 citations73
LIN CHIH-SHENG
3 patentsUS8164113B2Apr 24, 2012
Electrostatic discharge structure for 3-dimensional integrated circuit through-silicon via device
LIN CHIH-SHENG34 citations90
US8314434B2Nov 20, 2012
Light emitting diode module and method of making the same
LIN CHIH-SHENG6 citations63
US8080829B2Dec 20, 2011
Light-emitting diode device including a multi-functional layer
LIN CHIH-SHENG2 citations52
SU KENG-LI
3 patentsUS8219340B2Jul 10, 2012
Monitoring method for through-silicon vias of three-dimensional intergrated circuit (3D IC) and apparatus using the same
SU KENG-LI11 citations82
US8581419B2Nov 12, 2013
Multi-chip stack structure
SU KENG-LI7 citations80
US9064837B2Jun 23, 2015
Monitoring method for three-dimensional intergrated circuit (3D IC) and apparatus using the same
SU KENG-LI3 citations60