Inventor

LEE MIN-LIN

TW44 patents

⚠️ This page may combine multiple inventors who share the name “LEE MIN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MIN-LIN

IND TECH RES INST

Coaxial via hole and process of fabricating the same

Hybrid capacitor

Circuit board having via and manufacturing method thereof

Capacitor devices

Capacitor devices

Method for testing component built in circuit board

Apparatus and method for testing component built in circuit board

Wiring structure of laminated capacitors

Signal transmission board and method for manufacturing the same

ESD protection structure

Packaging structure with low switching noises

Mirror image shielding structure

Structure of an interleaving striped capacitor substrate

Composite distributed dielectric structure

Embedded capacitor module

ESD protection substrate and integrated circuit utilizing the same

Regulable test integrated circuit system for signal noise and method of using same

Complementary mirror image embedded planar resistor architecture

Embedded capacitor core having a multiple-layer structure

Multi-functional composite substrate structure

Through hole capacitor and method of manufacturing the same

Embedded capacitor device having a common coupling area

Via structure

Circuit board with embedded components and manufacturing and measuring method thereof

Test method of embedded capacitor and test system thereof

Interconnect structure of an integrated circuit and manufacturing method thereof

Semiconductor substrate assembly

Circuit substrate

Multi-layer circuit structure

HSU CHIEN-MIN

Multilayer capacitors and methods for making the same

Electrically conductive structure of circuit board and circuit board using the same

Capacitor devices with co-coupling electrode planes

Capacitor devices having multi-sectional conductors

Embedded capacitor substrate module

Solid electrolytic capacitor and circuit board having the same

JOW UEI-MING

Multi-functional composite substrate structure

Mirror image shielding structure

KO CHENG-TA

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

CHENG CHENG-LIANG

Decoupling device

WU SHIH-HSIEN

Capacitor structure

LEE MIN-LIN

Stepwise capacitor structure and substrate employing the same

PERNG JIIN-SHING

Power device package structure

CHANG HUEY-RU

Capacitor devices with a filter structure

FIRST HI TEC ENTPR CO LTD

Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same