Inventor
KIM TAE-HYUK
KR3 patents
Patents
3 patentsUS5851853ADec 22, 1998
Method of attaching a die onto a pad of a lead frame
SAMSUNG ELECTRONICS CO LTD18 citations79
US6971863B2Dec 6, 2005
Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
SAMSUNG ELECTRONICS CO LTD2 citations61
US7631795B2Dec 15, 2009
System and method for automated wire bonding
SAMSUNG ELECTRONICS CO LTD3 citations55