Inventor

HUNG CALVIN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUNG CALVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

1 patent

US8921145B2Dec 30, 2014

Hybrid MEMS bump design to prevent in-process and in-use stiction

TAIWAN SEMICONDUCTOR MFG11 citations75

LAI JOHN

1 patent

US8631356B2Jan 14, 2014

Presentation of advertisements based on user interactivity with a web page

LAI JOHN13 citations73