Inventor
NAKANISHI TOSHIO
JP52 patents
⚠️ This page may combine multiple inventors who share the name “NAKANISHI TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
26 patentsUS8366953B2Feb 5, 2013
Plasma cleaning method and plasma CVD method
TOKYO ELECTRON LTD88 citations97
US7226874B2Jun 5, 2007
Substrate processing method
TOKYO ELECTRON LTD24 citations92
US6897149B2May 24, 2005
Method of producing electronic device material
TOKYO ELECTRON LTD24 citations92
US7960293B2Jun 14, 2011
Method for forming insulating film and method for manufacturing semiconductor device
TOKYO ELECTRON LTD7 citations84
US6290807B1Sep 18, 2001
Apparatus and method for microwave plasma process
TOKYO ELECTRON LTD17 citations84
US7723241B2May 25, 2010
Plasma processing method and computer storage medium
TOKYO ELECTRON LTD8 citations83
US7674722B2Mar 9, 2010
Method of forming gate insulating film, semiconductor device and computer recording medium
TOKYO ELECTRON LTD11 citations83
US7446052B2Nov 4, 2008
Method for forming insulation film
TOKYO ELECTRON LTD10 citations82
US7429539B2Sep 30, 2008
Nitriding method of gate oxide film
TOKYO ELECTRON LTD7 citations74
US7250375B2Jul 31, 2007
Substrate processing method and material for electronic device
TOKYO ELECTRON LTD9 citations74
US7232772B2Jun 19, 2007
Substrate processing method
TOKYO ELECTRON LTD7 citations74
US7217659B2May 15, 2007
Process for producing materials for electronic device
TOKYO ELECTRON LTD5 citations73
US10017853B2Jul 10, 2018
Processing method of silicon nitride film and forming method of silicon nitride film
TOKYO ELECTRON LTD2 citations72
US7820557B2Oct 26, 2010
Method for nitriding substrate and method for forming insulating film
TOKYO ELECTRON LTD4 citations63
US8021987B2Sep 20, 2011
Method of modifying insulating film
TOKYO ELECTRON LTD3 citations62
US7763551B2Jul 27, 2010
RLSA CVD deposition control using halogen gas for hydrogen scavenging
TOKYO ELECTRON LTD2 citations62
US7662236B2Feb 16, 2010
Method for forming insulation film
TOKYO ELECTRON LTD3 citations62
US7655574B2Feb 2, 2010
Method of modifying insulating film
TOKYO ELECTRON LTD3 citations62
US7622402B2Nov 24, 2009
Method for forming underlying insulation film
TOKYO ELECTRON LTD2 citations62
US7897518B2Mar 1, 2011
Plasma processing method and computer storage medium
TOKYO ELECTRON LTD4 citations61
US7374635B2May 20, 2008
Forming method and forming system for insulation film
TOKYO ELECTRON LTD3 citations61
US7166185B2Jan 23, 2007
Forming system for insulation film
TOKYO ELECTRON LTD2 citations61
US8569186B2Oct 29, 2013
Plasma CVD method, method for forming silicon nitride film and method for manufacturing semiconductor device
TOKYO ELECTRON LTD0 citations51
US10968513B2Apr 6, 2021
Plasma film-forming apparatus and substrate pedestal
TOKYO ELECTRON LTD0 citations50
US10190217B2Jan 29, 2019
Plasma film-forming method and plasma film-forming apparatus
TOKYO ELECTRON LTD0 citations47
US9779936B2Oct 3, 2017
Plasma processing method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations41
HONDA MINORU
3 patentsUS8247331B2Aug 21, 2012
Method for forming insulating film and method for manufacturing semiconductor device
HONDA MINORU3 citations62
US8158535B2Apr 17, 2012
Method for forming insulating film and method for manufacturing semiconductor device
HONDA MINORU4 citations62
US8119545B2Feb 21, 2012
Forming a silicon nitride film by plasma CVD
HONDA MINORU2 citations59
SUMITOMO METAL IND
2 patentsASM IP HOLDING BV
2 patentsUS10755922B2Aug 25, 2020
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
ASM IP HOLDING BV8 citations83
US11646197B2May 9, 2023
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
ASM IP HOLDING BV1 citations61
ENDOH TETSUO
2 patentsNGK SPARK PLUG CO
2 patentsKUBOTA KK
2 patentsKOHNO MASAYUKI
2 patentsUS8138103B2Mar 20, 2012
Plasma CVD method, method for forming silicon nitride film and method for manufacturing semiconductor device
KOHNO MASAYUKI1 citations60
US8329596B2Dec 11, 2012
Plasma CVD method, method for forming silicon nitride film and method for manufacturing semiconductor device
KOHNO MASAYUKI0 citations49
HOUYU CO LTD
1 patentMATSUSHITA ELECTRIC WORKS LTD
1 patentMITSUBISHI ELECTRIC CORP
1 patentKOSAKA TETSUYA
1 patentDAIKI ALUMINIUM IND
1 patentNEC CORP
1 patentUNIV TOHOKU
1 patentTOYKO ELECTRON LTD
1 patentMATSUYAMA SEIJI
1 patentShowing the top 50 of 52 patents by PatentIndex Score.