P

Inventor

MAITY NIRMALYA

US15 patents
⚠️ This page may combine multiple inventors who share the name “MAITY NIRMALYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

13 patents
US7211508B2May 1, 2007

Atomic layer deposition of tantalum based barrier materials

APPLIED MATERIALS INC139 citations99
US6350353B2Feb 26, 2002

Alternate steps of IMP and sputtering process to improve sidewall coverage

APPLIED MATERIALS INC175 citations99
US7595263B2Sep 29, 2009

Atomic layer deposition of barrier materials

APPLIED MATERIALS INC68 citations98
US7524762B2Apr 28, 2009

Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA

APPLIED MATERIALS INC61 citations98
US7264846B2Sep 4, 2007

Ruthenium layer formation for copper film deposition

APPLIED MATERIALS INC87 citations98
US7241686B2Jul 10, 2007

Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA

APPLIED MATERIALS INC89 citations98
US7049226B2May 23, 2006

Integration of ALD tantalum nitride for copper metallization

APPLIED MATERIALS INC514 citations98
US6841050B2Jan 11, 2005

Small planetary magnetron

APPLIED MATERIALS INC36 citations91
US7169271B2Jan 30, 2007

Magnetron executing planetary motion adjacent a sputtering target

APPLIED MATERIALS INC11 citations82
US7691742B2Apr 6, 2010

Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA

APPLIED MATERIALS INC2 citations63
US7807030B2Oct 5, 2010

Small scanned magentron

APPLIED MATERIALS INC4 citations61
US12094726B2Sep 17, 2024

Adapting electrical, mechanical, and thermal properties of package substrates

APPLIED MATERIALS INC0 citations49
US12001193B2Jun 4, 2024

Apparatus for environmental control of dies and substrates for hybrid bonding

APPLIED MATERIALS INC0 citations47

CHUNG HUA

1 patent

DINON JOHN L

1 patent