Inventor
HWANG CHANG YOUN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “HWANG CHANG YOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
11 patentsUS6569778B2May 27, 2003
Method for forming fine pattern in semiconductor device
HYNIX SEMICONDUCTOR INC22 citations92
US7709367B2May 4, 2010
Method for fabricating storage node contact in semiconductor device
HYNIX SEMICONDUCTOR INC12 citations82
US6867145B2Mar 15, 2005
Method for fabricating semiconductor device using photoresist pattern formed with argon fluoride laser
HYNIX SEMICONDUCTOR INC11 citations74
US7427564B2Sep 23, 2008
Method for forming storage node contact plug in semiconductor device
HYNIX SEMICONDUCTOR INC7 citations73
US8034714B2Oct 11, 2011
Semiconductor device and method of fabricating the same
HYNIX SEMICONDUCTOR INC3 citations63
US7226829B2Jun 5, 2007
Method for fabricating semiconductor device
HYNIX SEMICONDUCTOR INC3 citations62
US7160814B2Jan 9, 2007
Method for forming contact in semiconductor device
HYNIX SEMICONDUCTOR INC5 citations61
US6703314B2Mar 9, 2004
Method for fabricating semiconductor device
HYNIX SEMICONDUCTOR INC3 citations61
US7419896B2Sep 2, 2008
Method for forming landing plug contact in semiconductor device
HYNIX SEMICONDUCTOR INC3 citations60
US7745331B2Jun 29, 2010
Method for fabricating contact plug in semiconductor device
HYNIX SEMICONDUCTOR INC1 citations52
US7842593B2Nov 30, 2010
Semiconductor device and method for fabricating the same
HYNIX SEMICONDUCTOR INC1 citations51
SAMSUNG ELECTRONICS CO LTD
9 patentsUS7414213B2Aug 19, 2008
Manufacturing method of keypad for mobile phone and keypad manufactured thereby
SAMSUNG ELECTRONICS CO LTD97 citations95
US9699926B2Jul 4, 2017
Case, method of manufacturing case, and electronic device
SAMSUNG ELECTRONICS CO LTD13 citations83
US10153799B2Dec 11, 2018
Electronic device case and material layer details of the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US9306268B2Apr 5, 2016
Electronic device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations72
US11310930B2Apr 19, 2022
Electronic device having waterproof structure
SAMSUNG ELECTRONICS CO LTD3 citations68
USRE50182EOct 22, 2024
Electronic device case and material layer details of the same
SAMSUNG ELECTRONICS CO LTD0 citations61
USRE49451EMar 7, 2023
Electronic device case and material layer details of the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US7646956B2Jan 12, 2010
Optical waveguide sheet and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD2 citations55
US9867298B2Jan 9, 2018
Case frame and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD1 citations49
SK HYNIX INC
5 patentsUS9425200B2Aug 23, 2016
Semiconductor device including air gaps and method for fabricating the same
SK HYNIX INC42 citations96
US9337203B2May 10, 2016
Semiconductor device with line-type air gaps and method for fabricating the same
SK HYNIX INC31 citations93
US10411014B2Sep 10, 2019
Semiconductor device including air gaps and method for fabricating the same
SK HYNIX INC7 citations82
US9620451B2Apr 11, 2017
Semiconductor memory device with selectively located air gaps
SK HYNIX INC15 citations82
US11296088B2Apr 5, 2022
Semiconductor device including air gaps and method for fabricating the same
SK HYNIX INC2 citations71