Inventor
BAYAN JAIME A
US35 patents
⚠️ This page may combine multiple inventors who share the name “BAYAN JAIME A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
30 patentsUS6872599B1Mar 29, 2005
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP94 citations97
US6777788B1Aug 17, 2004
Method and structure for applying thick solder layer onto die attach pad
NAT SEMICONDUCTOR CORP96 citations97
US6781243B1Aug 24, 2004
Leadless leadframe package substitute and stack package
NAT SEMICONDUCTOR CORP67 citations96
US7705476B2Apr 27, 2010
Integrated circuit package
NAT SEMICONDUCTOR CORP23 citations93
US6364089B1Apr 2, 2002
Multi-station rotary die handling device
NAT SEMICONDUCTOR CORP46 citations93
US7619303B2Nov 17, 2009
Integrated circuit package
NAT SEMICONDUCTOR CORP45 citations92
US7087986B1Aug 8, 2006
Solder pad configuration for use in a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP33 citations92
US7023074B2Apr 4, 2006
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP32 citations92
US6932136B1Aug 23, 2005
Post singulation die separation apparatus and method for bulk feeding operation
NAT SEMICONDUCTOR CORP19 citations92
US6483180B1Nov 19, 2002
Lead frame design for burr-free singulation of molded array packages
NAT SEMICONDUCTOR CORP48 citations92
US7836586B2Nov 23, 2010
Thin foil semiconductor package
NAT SEMICONDUCTOR CORP15 citations91
US5146310ASep 8, 1992
Thermally enhanced leadframe
NAT SEMICONDUCTOR CORP29 citations91
US7186588B1Mar 6, 2007
Method of fabricating a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP27 citations89
US5569956AOct 29, 1996
Interposer connecting leadframe and integrated circuit
NAT SEMICONDUCTOR CORP51 citations89
US7064419B1Jun 20, 2006
Die attach region for use in a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP23 citations88
US6797540B1Sep 28, 2004
Dap isolation process
NAT SEMICONDUCTOR CORP28 citations86
US6930377B1Aug 16, 2005
Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages
NAT SEMICONDUCTOR CORP16 citations84
US5780772AJul 14, 1998
Solution to mold wire sweep in fine pitch devices
NAT SEMICONDUCTOR CORP19 citations84
US7491625B2Feb 17, 2009
Gang flipping for IC packaging
NAT SEMICONDUCTOR CORP9 citations82
US6001723ADec 14, 1999
Application of wire bond loop as integrated circuit package component interconnect
NAT SEMICONDUCTOR CORP12 citations74
US7045035B1May 16, 2006
Post singulation die separation apparatus and method for bulk feeding operation
NAT SEMICONDUCTOR CORP8 citations73
US7598122B1Oct 6, 2009
Die attach method and microarray leadframe structure
NAT SEMICONDUCTOR CORP7 citations71
US7944032B2May 17, 2011
Integrated circuit package with molded insulation
NAT SEMICONDUCTOR CORP2 citations63
US7923825B2Apr 12, 2011
Integrated circuit package
NAT SEMICONDUCTOR CORP4 citations63
US7612435B2Nov 3, 2009
Method of packaging integrated circuits
NAT SEMICONDUCTOR CORP2 citations63
US7432583B2Oct 7, 2008
Leadless leadframe package substitute and stack package
NAT SEMICONDUCTOR CORP3 citations62
US7859090B2Dec 28, 2010
Die attach method and leadframe structure
NAT SEMICONDUCTOR CORP2 citations60
US7893523B2Feb 22, 2011
Microarray package with plated contact pedestals
NAT SEMICONDUCTOR CORP0 citations51
US8341828B2Jan 1, 2013
Thin foil semiconductor package
NAT SEMICONDUCTOR CORP0 citations50
US8377267B2Feb 19, 2013
Foil plating for semiconductor packaging
NAT SEMICONDUCTOR CORP0 citations49
BAYAN JAIME A
3 patentsUS8450149B2May 28, 2013
Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology
BAYAN JAIME A13 citations75
US8222716B2Jul 17, 2012
Multiple leadframe package
BAYAN JAIME A6 citations71
US8293573B2Oct 23, 2012
Microarray package with plated contact pedestals
BAYAN JAIME A0 citations50