Inventor
WU TING-HAU
TW32 patents
⚠️ This page may combine multiple inventors who share the name “WU TING-HAU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
12 patentsUS9238581B2Jan 19, 2016
Triple-axis MEMS accelerometer
TAIWAN SEMICONDUCTOR MFG50 citations98
US8053336B2Nov 8, 2011
Method for reducing chip warpage
TAIWAN SEMICONDUCTOR MFG5 citations74
US9281287B2Mar 8, 2016
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG3 citations71
US7998775B2Aug 16, 2011
Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures
TAIWAN SEMICONDUCTOR MFG3 citations63
US7923379B2Apr 12, 2011
Multi-step process for forming high-aspect-ratio holes for MEMS devices
TAIWAN SEMICONDUCTOR MFG2 citations63
US8878355B2Nov 4, 2014
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG2 citations61
US9394164B2Jul 19, 2016
MEMS method and structure
TAIWAN SEMICONDUCTOR MFG0 citations52
US9321632B2Apr 26, 2016
Socket type MEMS bonding
TAIWAN SEMICONDUCTOR MFG0 citations52
US8367516B2Feb 5, 2013
Laser bonding for stacking semiconductor substrates
TAIWAN SEMICONDUCTOR MFG1 citations52
US8362578B2Jan 29, 2013
Triple-axis MEMS accelerometer
TAIWAN SEMICONDUCTOR MFG1 citations52
US8053377B2Nov 8, 2011
Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
TAIWAN SEMICONDUCTOR MFG0 citations52
US7999257B2Aug 16, 2011
Process for eliminating delamination between amorphous silicon layers
TAIWAN SEMICONDUCTOR MFG0 citations44
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS11104129B2Aug 31, 2021
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10889493B2Jan 12, 2021
MEMS method and structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9502370B2Nov 22, 2016
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations61
US10688786B2Jun 23, 2020
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10160642B2Dec 25, 2018
MEMS method and structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9950522B2Apr 24, 2018
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9677884B2Jun 13, 2017
Methods of forming a gyroscope sensor and a structure for a gyroscope sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9156685B2Oct 13, 2015
Method for the prevention of suspended silicon structure etching during reactive ion etching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US8987845B2Mar 24, 2015
Method for the prevention of suspended silicon structure etching during reactive ion etching
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10023459B2Jul 17, 2018
MEMS and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
WU TING-HAU
7 patentsUS8455999B2Jun 4, 2013
Method for reducing chip warpage
WU TING-HAU5 citations83
US8281658B2Oct 9, 2012
Method to produce 3-D optical gyroscope my MEMS technology
WU TING-HAU3 citations62
US8218286B2Jul 10, 2012
MEMS microphone with single polysilicon film
WU TING-HAU2 citations62
US8776600B2Jul 15, 2014
Gyroscope sensors
WU TING-HAU0 citations51
US8237235B2Aug 7, 2012
Metal-ceramic multilayer structure
WU TING-HAU1 citations51
US8106470B2Jan 31, 2012
Triple-axis MEMS accelerometer having a bottom capacitor
WU TING-HAU0 citations51
US8237263B2Aug 7, 2012
Method and apparatus for cooling an integrated circuit
WU TING-HAU0 citations50