Inventor
LEE JIOU-KANG
TW37 patents
⚠️ This page may combine multiple inventors who share the name “LEE JIOU-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS9604840B1Mar 28, 2017
MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11186481B2Nov 30, 2021
Sensor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9617147B2Apr 11, 2017
Dual layer microelectromechanical systems device and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11180365B2Nov 23, 2021
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11104129B2Aug 31, 2021
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10266399B2Apr 23, 2019
Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10688786B2Jun 23, 2020
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10457550B2Oct 29, 2019
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10099919B2Oct 16, 2018
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9950522B2Apr 24, 2018
MEMS devices and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9725299B1Aug 8, 2017
MEMS device and multi-layered structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9677884B2Jun 13, 2017
Methods of forming a gyroscope sensor and a structure for a gyroscope sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9499396B2Nov 22, 2016
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9422151B1Aug 23, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
TAIWAN SEMICONDUCTOR MFG
11 patentsUS9238581B2Jan 19, 2016
Triple-axis MEMS accelerometer
TAIWAN SEMICONDUCTOR MFG50 citations98
US9133017B2Sep 15, 2015
MEMS structure with adaptable inter-substrate bond
TAIWAN SEMICONDUCTOR MFG49 citations98
US8748205B1Jun 10, 2014
MEMS structure with adaptable inter-substrate bond
TAIWAN SEMICONDUCTOR MFG5 citations84
US8053336B2Nov 8, 2011
Method for reducing chip warpage
TAIWAN SEMICONDUCTOR MFG5 citations74
US9006015B2Apr 14, 2015
Dual layer microelectromechanical systems device and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG2 citations63
US7998775B2Aug 16, 2011
Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures
TAIWAN SEMICONDUCTOR MFG3 citations63
US7923379B2Apr 12, 2011
Multi-step process for forming high-aspect-ratio holes for MEMS devices
TAIWAN SEMICONDUCTOR MFG2 citations63
US8367516B2Feb 5, 2013
Laser bonding for stacking semiconductor substrates
TAIWAN SEMICONDUCTOR MFG1 citations52
US8362578B2Jan 29, 2013
Triple-axis MEMS accelerometer
TAIWAN SEMICONDUCTOR MFG1 citations52
US8053377B2Nov 8, 2011
Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
TAIWAN SEMICONDUCTOR MFG0 citations52
US7999257B2Aug 16, 2011
Process for eliminating delamination between amorphous silicon layers
TAIWAN SEMICONDUCTOR MFG0 citations44
WU TING-HAU
7 patentsUS8455999B2Jun 4, 2013
Method for reducing chip warpage
WU TING-HAU5 citations83
US8281658B2Oct 9, 2012
Method to produce 3-D optical gyroscope my MEMS technology
WU TING-HAU3 citations62
US8218286B2Jul 10, 2012
MEMS microphone with single polysilicon film
WU TING-HAU2 citations62
US8776600B2Jul 15, 2014
Gyroscope sensors
WU TING-HAU0 citations51
US8237235B2Aug 7, 2012
Metal-ceramic multilayer structure
WU TING-HAU1 citations51
US8106470B2Jan 31, 2012
Triple-axis MEMS accelerometer having a bottom capacitor
WU TING-HAU0 citations51
US8237263B2Aug 7, 2012
Method and apparatus for cooling an integrated circuit
WU TING-HAU0 citations50