Inventor
VARIYAM MANJULA N
US5 patents
Patents
5 patentsUS7294451B2Nov 13, 2007
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
TEXAS INSTRUMENTS INC20 citations90
US6696644B1Feb 24, 2004
Polymer-embedded solder bumps for reliable plastic package attachment
TEXAS INSTRUMENTS INC25 citations90
US7085699B2Aug 1, 2006
Wire bonding simulation
TEXAS INSTRUMENTS INC5 citations59
US6953707B2Oct 11, 2005
Method and system for chip-to-package interconnection
TEXAS INSTRUMENTS INC4 citations59
US7679190B2Mar 16, 2010
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
TEXAS INSTRUMENTS INC0 citations50