Inventor
HUGO STEPHEN M
US19 patents
Patents
19 patentsUS10575448B1Feb 25, 2020
Electromagnetic shielding of heat sinks with shape-memory alloy grounding
IBM20 citations92
US10048312B1Aug 14, 2018
Testing printed circuit board assembly
IBM9 citations83
US10679926B2Jun 9, 2020
Method of making integrated die paddle structures for bottom terminated components
IBM1 citations72
US10168383B2Jan 1, 2019
Testing printed circuit board assembly
IBM2 citations72
US10677856B2Jun 9, 2020
Facilitating reliable circuit board press-fit connector assembly fabrication
IBM2 citations70
US10262907B1Apr 16, 2019
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM2 citations70
US11175100B2Nov 16, 2021
Heat sinks using memory shaping materials
IBM0 citations61
US10559522B2Feb 11, 2020
Integrated die paddle structures for bottom terminated components
IBM0 citations51
US10083894B2Sep 25, 2018
Integrated die paddle structures for bottom terminated components
IBM0 citations51
US9986649B2May 29, 2018
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9662732B2May 30, 2017
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9427828B2Aug 30, 2016
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9232664B2Jan 5, 2016
Heat transfer device for wave soldering
IBM0 citations51
US9148962B2Sep 29, 2015
Heat transfer device for wave soldering
IBM0 citations51
US10073134B2Sep 11, 2018
Laminate bond strength detection
IBM0 citations50
US9910085B2Mar 6, 2018
Laminate bond strength detection
IBM0 citations50
US11245238B2Feb 8, 2022
Tool for shaping contact tab interconnects at a circuit card edge
IBM0 citations49
US10593601B2Mar 17, 2020
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM0 citations49
US11268809B2Mar 8, 2022
Detecting and correcting deficiencies in surface conditions for bonding applications
IBM0 citations48